Wire Bonding Excellence with the Westbond 4KE for Microelectronics

The Westbond 4KE Wire Bonder is a cornerstone of microelectronics, providing precise electrical interconnects for high-performance devices. Supporting ball and wedge bonding, it ensures reliable connections for applications like sensors and RF modules.

With programmable controls for force, ultrasonics, and loop height, the 4KE achieves bond strengths exceeding 7 grams for gold wires as thin as 10 microns. Its semi-automatic operation balances speed and precision, ideal for both R&D and production.

Our nanofabrication services use the 4KE to create interconnects for MEMS gyroscopes, achieving a 99% bonding yield. We optimize recipes to minimize voids, verified through destructive testing. Consultation services advise on wire materials and bonding parameters, ensuring compatibility with substrates like ceramics or flexible polymers.

As interconnect demands grow with IoT and wearable devices, the 4KE’s adaptability ensures it meets future challenges. Our expertise delivers reliable, high-quality interconnects that power innovative technologies.