High-Reliability Bonding with the EVG Bonder for Advanced Devices

Wafer bonding is a critical process in nanotechnology, and the EVG Bonder delivers unmatched precision for creating robust, multilayer devices. Supporting anodic, thermo-compression, and fusion bonding, it caters to applications from MEMS to 3D ICs.

The Bonder’s sub-micron alignment and uniform pressure distribution ensure high-strength bonds, essential for hermetic sealing in sensors or stacking in memory chips. Its versatility accommodates various wafer sizes and materials, from silicon to glass, enabling hybrid integration.

Our services use the EVG Bonder to assemble complex devices, such as micro-mirrors for optical switches, achieving alignment accuracies of ±0.5 microns. We optimize bonding conditions, like temperature profiles, to minimize stress and maximize yield, verified through acoustic microscopy.

Consultation services guide clients in selecting bonding techniques and surface treatments, ensuring compatibility with device requirements. As bonding technologies evolve with hybrid bonding for 5G, our facility delivers solutions that meet the demands of next-generation devices.