Precision Interconnects with the Westbond 4KE Wire Bonder for Microelectronics

Reliable electrical interconnects are the foundation of microelectronic devices, and the Westbond 4KE Wire Bonder delivers the precision required for high-performance applications. Supporting both ball and wedge bonding, it caters to diverse needs in semiconductor packaging and MEMS assembly.

Ball bonding forms robust connections by melting a wire into a ball and bonding it to a pad, ideal for high-density ICs. Wedge bonding, using ultrasonic energy, suits applications requiring low-profile connections, such as RF devices. The 4KE’s programmable controls allow fine-tuning of bond parameters, achieving pull strengths exceeding 6 grams for gold wires as thin as 15 microns.

Our nanofabrication services leverage the 4KE to create reliable interconnects for sensors, actuators, and hybrid circuits. We optimize bonding recipes to minimize defects, verified through shear and pull testing. In a recent project, we used the 4KE to assemble a micro-LED array, achieving a 98% bonding yield.

The tool’s versatility supports emerging applications, such as flexible electronics, where low-temperature bonding is critical. Our team provides consultation on wire material selection and bonding conditions, ensuring compatibility with substrates like polymers or ceramics.

As interconnect demands grow with 5G and IoT, the 4KE’s adaptability positions it for future challenges. Our services deliver robust, high-quality interconnects that power the next generation of devices.