Optimizing Wafer Fabrication with Advanced Dicing and Bonding Technologies

Wafer fabrication is a critical step in nanotechnology, requiring precision tools like the DISCO Dicer and Westbond 4KE Wire Bonder to achieve high-quality results. These systems enable the production of reliable micro- and nanodevices for applications ranging from consumer electronics to biomedical systems.

The DISCO Dicer utilizes advanced cutting technologies, including ultra-thin diamond blades and laser-based ablation, to singulate wafers with minimal kerf loss. Capable of cutting materials like silicon, GaN, and ceramics with precision down to 10 microns, it ensures clean edges and high die integrity. Its automated vision systems align cuts with sub-micron accuracy, critical for high-yield production of sensors or power devices.

The Westbond 4KE Wire Bonder complements this by providing robust electrical interconnects through ball and wedge bonding. Its programmable controls allow for precise adjustments of bonding parameters, achieving reliable connections for wires as fine as 12 microns. This versatility supports applications like LED packaging, where low-resistance bonds enhance performance.

Our nanofabrication services integrate these tools to deliver end-to-end solutions. For instance, we dice wafers into individual chips using the DISCO Dicer, then use the Westbond 4KE to create interconnects for a biosensor array, achieving a 95% bonding success rate. Post-processing, we verify quality through shear testing and optical inspection, ensuring compliance with industry standards.

Our expertise extends to optimizing dicing speeds and bonding conditions for specific materials, reducing defects and costs. As wafer fabrication advances with technologies like plasma dicing, our services at TU Delft ensure clients stay ahead, delivering high-performance devices with efficiency.