The Oxford ICP-CL is a cutting-edge dry etching tool leveraging Inductively Coupled Plasma (ICP) technology for high-precision etching in nanotechnology. It delivers exceptional etch uniformity, rapid etch rates, and precise patterning of complex nanostructures on diverse substrates. Ideal for both research and industrial applications, this system ensures reliable, repeatable results, making it an essential tool for advanced nanofabrication processes.